Features

• Density 
  • 1 Gb / 2 Gb / 4 Gb  
• Architecture 
  • Input / Output Bus Width: 8 bits / 16 bits 
  • Page size: 
    • ×8: 
      • 1 Gb: (2048 + 64) bytes; 64-byte spare area 
      • 2 Gb / 4 Gb: (2048 + 128) bytes; 128-byte spare area 
    • ×16:
      • 1 Gb: (1024 + 32) words; 32-word spare area 
      • 2 Gb / 4 Gb (1024 + 64) words; 64-word spare area 
  • – Block size: 64 Pages 
    • ×8:
      • 1 Gb: 128 KB+ 4 KB 
      • 2 Gb / 4 Gb: 128 KB + 8 KB 
    • ×16
      • 1 Gb: 64k + 2k words 
      • 2 Gb / 4 Gb: 64k + 4k words 
  • – Plane size
    • ×8 
      • 1 Gb: 1024 blocks per plane or (128 MB + 4 MB) 
      • 2 Gb: 1024 blocks per plane or (128 MB + 8 MB)
      • 4 Gb: 2048 blocks per plane or (256 MB + 16 MB)
    • ×16 
      • 1 Gb: 1024 blocks per plane or (64M + 2M) words 
      • 2 Gb: 1024 Blocks per Plane or (64M + 4M) words 
      • 4 Gb: 2048 Blocks per Plane or (128M + 8M) words
  • Device Size 
    • 1 Gb: 1 plane per device or 128 Mbyte 
    • 2 Gb: 2 planes per device or 256 Mbyte 
    • 4 Gb: 2 planes per device or 512 Mbyte  
• NAND Flash interface 
  • Open NAND Flash Interface (ONFI) 1.0 compliant 
  • Address, Data, and Commands multiplexed  
• Supply Voltage
  •  3.3-V device: VCC = 2.7 V ~ 3.6 V  
• Security 
  • One Time Programmable (OTP) area 
  • Serial number (unique ID) (Contact factory for support) 
  • Hardware program/erase disabled during power transition 
•  Additional features 
  • 2 Gb and 4 Gb parts support Multiplane Program and Erase commands 
  • Supports Copy Back Program 
  • 2 Gb and 4 Gb parts support Multiplane Copy Back Program 
  • Supports Read Cache  
• Electronic signature 
  • Manufacturer ID: 01h  
• Operating temperature 
  • Industrial: –40 °C to 85 °C 
  • Industrial Plus: –40 °C to 105 °C