Features:

• For surface mounted applications in order to optimize board space. 
• Low profile package. 
• Built-in strain relief. 
• Glass passivated junction. 
• Low inductance. 
• Excellent clamping capability. 
• Repetition Rate (duty cycle): 0.01%. 
• Fast response time: typically less than 1.0ps from 0 volt to VBR for 8nidirectional types. 
• Typical IR less than 1μA above 10V. 
• High Temperature soldering: 260°C/10 seconds at terminals. 
• Plastic package has Underwriters Laboratory Flammability 94V-O.