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embedded systems

TANK-XM811-I9AD-R10
Manufacturer's P/N:
Show more information about the brand IEI Integration Corp.

Ruggedized Fanless Embedded System With Intel i9, 16GB RAM,1xHDMI,1xDP++, 12~28V DC and RoHS
ProcessorIntel i9-12900TE
RAM memoryup to 64GB
CoolingPasywne
Extensions2xM.2 1x2,5"
Power supply voltage12-28V DC
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Features:

  • supported CPU: Intel® Core™ i9-12900TE 1.1 GHz (up to 4.8 GHz, 16-core, 35W TDP)
  • 2 x 2.5GbE ports
  • multiple USB ports and serial ports
  • multiple internal expansion boards for flexible selection
  • various optional backplanes and chassis
  • CE/FCC compliant

Specification:

  • SBC form factor: 
    • CPU: 12th Gen Intel® Core™ CPU 35/65W
    • Intel® Core™ i9-12900TE 1.1 GHz (up to 4.8 GHz, 16-core, 35W TDP)
    • chipset: R680E
    • system memory: 2 x SO-DIMM DDR4 3200 (8GB pre-installed) (up to 64GB)
  • power:
    • DC jack: 12 V~28 V DC
    • terminal block: 12 V~28 V DC
    • consumption: 12V @ 8.8A (Intel® Core™ i9-12900TE with 16GB memory)
  • I/O ports: USB: 8 x USB 3.2 Gen 2
  • Ethernet: 
    • 2 x RJ-45:
    • 2 x 2.5 GbE by Intel ® I225V (colay I225LM)
  • COM port:
    • 2 x RS-232/422/485
    • 4 x RS-232
  • digital I/O: 12-bit Digital I/O (6-in/ 6-out)
  • display:
    • 1 x HDMI
    • 1 x DP++
  • TPM: support Intel PTT
  • watchdog timer: programmable 1 ~ 255 sec/min
  • expansion slots:
    • M.2:
    • 1 x 2280 M-key (PCIe x4)
    • 1 x 2230 A-key (USB+PCIe x1, supports vPRO)
  • backplane: optional
  • system:
    • cooling method / system fan: 
    • fanless
    • 4-pin external system fan connector
    • drive bays: 1 x 2.5" SATA 6Gb/s HDD/SSD bay
  • indicator&buttons:
    • buttons:
      • 1 x power button
      • 1 x reset button
      • 1 x AT/ATX switch
    • indicators:
      • 1 x power LED (green)
      • 1 x HDD LED (yellow)
  • physical characteristics: 
    • construction: extruded aluminum alloy
    • color: black
    • dimensions: 230.6 x 256.04 x 76.2
    • weight: 3.33/3.7 kg
  • environment:
    • operating temperature:
      • -20°C ~ 60°C with air flow (CPU TDP35W & SSD)
      • -20°C ~ 50°C with air flow (CPU TDP65W & SSD)
    • humidity: 10% ~ 95% non-condensing
    • operating vibration: half-sine wave shock 5G, 11ms, 100 shocks per axis (SSD)
    • operating shock: MIL-STD-810G 514.6C-1 (SSD)
    • safety & EMC: CE/FCC compliant
  • OS support: Microsoft Windows 10 / Windows 11, Linux

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