IEI has developed a highly efficient thermal solution for the 3.5" motherboard - IEI Heat Conduction Casing (IHCC). With its welldesign structure, the IHCC can effectively improve heat transfer performance and cut time-to-market. Completely joint with CPU for better heat transfer in 0ºC~60ºC operating temperature with the active cooling (PN:19XM0B619-0002001-000-RS), and in 0°C~45°C operating temperature with the passive cooling (PN:19XM0B619-0002002-000-RS).

The DRPC-W-JL-R10 is a compact embedded system and designed for 3.5" single board computers . With the two-dimensional heat conduction and low wind resistance design on the surfaced which means you don’t need extra thermal solution to form the heat dissipation part. You can get higher hardness, and benefit from the reduced production cost resulting from shortening manufacturing time .Furthermore, the height of aluminum extrusion can therefore be downsized to make the product light weight.

Features:

• Supports Intel® Tiger Lake-UP3 processors: Intel® 11th Gen. Core™ i7/i5/i3, Celeron® UP3 processor, high performance, can handle multitasking at the same time
• Support Intel® I225V 2.5GbE network controller chip 
• USB 3.2 Gen1/Gen 2 interface, transfer rate up to 10Gb/s 
• IEI uniquely designs IDPM interface, which can be connected to module cards, and can freely choose to add LVDS/eDP/VGA display interface 

Specification:

• SOC: 
  • 11th Gen. Intel® mobile Tiger Lake-UP3 SoC
  • Intel® Core™ i3-1115G4E (up to 4.1GHz, quad-core, 6M Cache, TDP=28/15/12W)
• AMI UEFI BIOS
• memory: 1 x 260-pin 3200 MHz DDR4 SO-DIMMs support up to 32 GB
• graphics engine: Intel® Gen11 UHD Graphics 
• display output
  • four independent displays
  • 2 x HDMI 1.4 (up to 4096 x 2160@30Hz)
  • 1 x DP 1.4(up to 4096 x 2160 @60Hz)
  • 1 x IEI IDPM 3040 slot (only for IEI eDP/LVDS/VGA module)
• Ethernet: 
  • LAN1: Intel® I225V 2.5GbE
  • LAN2: Intel® I225V 2.5GbE
  • LAN3: Intel® I225V 2.5GbE 
• external I/O: 4 x USB 3.2 Gen2(10Gb/s) 
• internal I/O:
  • 1 x SATA 6Gb/s
  • 2 x USB 2.0 Pin Header(p=2.0)
  • 2 x RS-232/422/485 (2 x 5 pin, P=2.0)
  • 1 x RS-232 (2 x 5 pin, P=2.0)
• 1 x I2C(1x4 pin)
• 1 x IAUDIO (2x5 pin)Support IEI AC-KIT-888S kit
• front panel:
  • 1 x Power LED & HDD LED (1x6 pin P=2.0) 
  • 1 x Power button (1x2 pin P=2.0) 
  • 1 x Reset button (1x2 pin P=2.0)
• 3 x LAN LED (1x2 pin)
• expansion:
  • 1 x M.2 A Key for WIFI & BT (2230) (PCIe Gen3 x1/USB 2.0 signal)
  • 1 x M.2 B key (3052/2042) w/ SIM holder (PCIe Gen3 x2/USB 2.0 signal)
• digital I/O: 1 x 12-bit Digital I/O(2 x 7pin,)
• TPM: Intel® PTT(TPM 2.0)
• 1 x System fan connector (1x4 pin)
• power supply: +12V DC input power (AT/ATX mode)
• watchdog timer: software programmable support 1~255 sec. system reset
• operating temperature: 0°C ~ 60°C
• storage temperature: -20°C ~ 70°C 
• operating humidity: 5% ~95%, non-condensing
• dimensions: 115mm x 165mm
• weight: gross: 850g / net: 350g
• certification: CE/FCC compliant