The WAFER-ADL-N is a 3.5-inch Single Board Computer that supports 12th Intel® Processor N-series on-board SoC. It features triple display, dual 2.5 GbE for high-speed networking, USB 3.2 Gen 2 for fast data transfer, M.2 for NVMe SSD and SATA 6Gb/s for storage expansion, and COM for serial communication. It is suitable for industrial automation, embedded systems, digital signage, kiosks, gaming machines, and edge computing. It is powerful, versatile, and ideal for demanding applications in various industries.

The WAFER-ADL-N Series is powered by the 12th Gen Intel® Processor N Series. They provide 42% improved performance and consume less power, making them ideal for demanding tasks while conserving energy. These processors offer robust computing for various purposes, including media editing and running complex software. They are well-suited for gaming, data processing, and artificial intelligence industries. Their high performance and energy efficiency make them an excellent option for powerful computing across diverse applications.

The WAFER-ADL-N has Intel® UHD Graphics and can handle three separate displays. It is great for many IoT uses that need multiple screens. Whether you want to show information on different displays or use many screens at once, its powerful graphics make integrating everything easy. It is also triple display feature is ideal for IoT applications needing to manage multiple screens efficiently.

The outwards-facing riser card, NWR-L2S, enables the connection of up to two outwards-facing PCIe x1 slots via one PCI Express interface. Although may take up more space, it can help enhance the airflow and heat transfer within the system. It is ideal for the chassis that is wide enough for the expansion card to be placed.

IEI has developed a highly efficient thermal solution for the 3.5" SBC - the IEI Heat Conduction Casing (IHCC). The IHCC effectively enhances heat transfer performance by targeting the primary heat source, thus eliminating the need for designing a separate heat spreader.

The IHCC consists of a casing and a heat conduction block that securely fits over the key components where the major heat is generated, ensuring optimal heat transfer.

The WAFER-ADL-N delivers unmatched performance with DDR5 memory, which offers more storage, lower power, and DDR4 compatibility. This cutting-edge solution unlocks limitless possibilities, revolutionizing your computing experience with a bandwidth supporting up to 4800Hz, 50% higher than the previous generation's 3200Hz.

The M.2 2230 A key slot carrying with PCIe Gen3 x1 and USB 2.0 signals allows it to adopt the latest Wi-Fi 6E technology. Wi-Fi 6E enhances low latency and supports service levels that are equivalent to 5G networks.

The M.2 2242/80 M Key slot for PCIe offers advantages including high-speed data transfer, increased storage capacity, compact size, improved system performance, and compatibility with the efficient NVMe protocol.

2.5 GbE allows for different connection speeds ranging from 100 Mbps to 2.5 Gbps on Cat 6 and Cat 5e cables, enabling users to fully utilize high-performance network solutions without costly cable upgrades.

Features:

• 12th/13th Intel® Alder Lake-N/Amston Lake on board SoC
• dual channal on-board LPDDR5 8G pre-installed (system max.16G) 
• triple independent display via  1 x HDMI 2.0, 1 x DP 1.4b, 1 x iDPM slot
• high speed I/O interface for USB 3.2 Gen 2, SATA 6Gb/s
• M.2 A Key, M.2 M key, PCIe x4 slot (x2 signal) with riser card supported
• support two 2.5GbE LAN with I225V/I226V

Specification:

• system:
  • CPU: 
    • Intel® Alder Lake-N N97 SoC
    • Intel® Alder Lake-N N200 SoC
  • memory: dual channal LPDDR5x 8G pre-installed (system max. 16G)
  • memory max.: 16GB
• physical characteristics:
  • dimensions (LxWxH): 146mm x 102mm 
  • net weight: 350g
• storage: 
  • 1 x SATA : 6Gb/s
  • 1 x M.2(NGFF) : 1 x M.2 M Key 2280 (PCIe Gen3 x1)
• I/O interface:
  • display output: 
    • 1 x HDMI™ : up to 4096 x 2160 @ 30Hz
    • 1 x display port : up to 4096 x 2160 @ 60Hz
    • 1 x iDPM (only for IEI eDP/LVDS/VGA module)
  • Ethernet:
    • 2 x LAN
    • LAN1: Intel® I225V/I226V 2.5GbE controller
    • LAN2: Intel® I225V/I226V 2.5GbE controller
  • audio: 1 x HD audio : 1 x iAUDIO, support IEI AC-KIT-888S Audio Module (2x5 pin)
  • I/O interface:
    • 2 x Internal RS-232/422/485 (1x9 pin, P=1.25)
    • 2 x External USB 2.0 (Type A)
    • 2 x Internal USB 2.0 (2x4 pin, P=2.0)
    • 2 x External USB 3.2 Gen2x1 (10Gb/s, Type A)
  • expansion:
    • 1 x PCIe x4 : PCIe Gen3 x2 signal
    • 2 x M.2(NGFF) -
    • 1 x M.2 A Key 2230 for WIFI & BT (PCIe Gen3 x 1 & USB 2.0)
    • 1 x M.2 M Key 2280 (PCIe Gen3 x1)
• power:
  • power consumption:
    • 12V@3.21A (Intel® processor N97 with 8 GB 4800 MHz LPDDR5 memory, max. loading, EuP mode disabled)
    • 12V@2.67A (Intel® processor N200 with 8 GB 4800 MHz LPDDR5 memory, max. loading, EuP mode disabled)
  • power supply:
    • ATX/AT power supply
    • support AT/ATX mode
    • ErP/EuP compliant
• environment
  • operating temperature: -10°C ~ 60°C
  • storage temperature: -20°C~70°C
  • humidity: 5% ~95%, non-condensing