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AT45DB321E-SHF-B
Manufacturer's P/N: AT45DB321E-SHF-B
Show more information about the brand ADESTO Technologies

DATA FLASH 32Mbit 85MHz 2.3-3.6V
Memory typeDataFlash
Memory size32M
Communication interfacesSPI
ChassisSOIC8(208mil)
Standard packaging:
90 pcs.

Minimum order:
1 pcs.

Minimum batch:
1350 pcs.

In stock:
Available

Features:

  • Single 2.3V - 3.6V supply
  • Serial Peripheral Interface (SPI) compatible
    • Supports SPI modes 0 and 3
    • Supports RapidS™ operation
  • Continuous read capability through entire array
    • Up to 85MHz
    • Low-power read option up to 15MHz
    • Clock-to-output time (tV) of 6ns maximum
  • User configurable page size
    • 512 bytes per page
    • 528 bytes per page (default)
    • Page size can be factory pre-configured for 512 bytes
  • Two fully independent SRAM data buffers (512/528 bytes)
  • Flexible programming options
    • Byte/Page Program (1 to 512/528 bytes) directly into main memory
    • Buffer Write
    • Buffer to Main Memory Page Program
  • Flexible erase options
    • Page Erase (512/528 bytes)
    • Block Erase (4 KB)
    • Sector Erase (64 KB)
    • Chip Erase (32 Mbits)
  • Program and Erase Suspend/Resume
  • Advanced hardware and software data protection features
    • Individual sector protection
    • Individual sector lock-down to make any sector permanently read-only
  • 128-byte, One-Time Programmable (OTP) Security Register
    • 64 bytes factory programmed with a unique identifier
    • 64 bytes user programmable
  • Hardware and software controlled reset options
  • JEDEC Standard Manufacturer and Device ID Read
  • Low-power dissipation
    • 400nA Ultra-Deep Power-Down current (typical)
    • 3uA Deep Power-Down current (typical)
    • 25uA Standby current (typical)
    • 7mA Active Read current (typical)
  • Endurance: 100,000 program/erase cycles per page minimum
  • Data retention: 20 years
  • Green (Pb/Halide-free/RoHS compliant) packaging options
    • 8-lead SOIC (0.208" wide)
    • 8-pad Ultra-thin DFN (5 x 6 x 0.6mm)
    • Die in Wafer Form

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