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evaluation kits, debuggers and programmers

WE310G4-I EVK
Manufacturer's P/N: 3990150724
Manufacturer: Telit Wireless Solutions

WE310G4-I evaluation board
Typeevaluation kit
Standard packaging:
1 pcs.

Minimum order:
1 pcs.

Minimum batch:
1 pcs.

In stock:
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The WE310G4 is a fully integrated, dual-band, combination Wi-Fi and Bluetooth® Low Energy 5.0 module. It provides an easy, cost-effective way for manufacturers to add wireless connectivity to their products.

The WE310G4 module enables device vendors to add dual-band Wi-Fi and Bluetooth® Low Power 5.0 connectivity quickly and cost-effectively to their products. This module provides an high-speed serial to Wi-Fi/Bluetooth® Low Power connection to an embedded design, built on an 8/16/32-bit microcontroller, through its interfaces. Furthermore, the module can be implemented as a hostless (stand-alone) solution, offering up to 456Kb of SRAM dedicated for customer application development. Based on the Realtek Ameba system on chip (SoC), the WE310G4 is ideal for a wide variety of embedded devices, including smart lighting, home appliances, medical wearables, smart city sensors, aftermarket telematics and industrial robots.

  • serial-to-Wi-Fi hosted implementation
  • Telit IoT AppZone IDE for hostless customer application development
  • ease of system integration, pin-to-pin compatible with WE310F5 (single-band module alternative)
  • wide range of peripherals (including UART, SPI, USB and SDIO)
  • advanced security features (including WPA3) with integrated crypto hardware
  • industrial-grade temperature range (-40° C to +85° C)
  • variants with (WE310G4-I) and without (WE310G4-P) antenna
  • legacy support for AT commands from GainSpan module family
  • certified module low power consumption
  • based on Realtek Ameba system on chip

Features:

  • Wi-Fi 802.11 a/b/g/n 2.4 GHz and 5 GHz
  • Bluetooth® Low Power 5.0
  • Wi-Fi AP/STA/concurrent
  • Bluetooth® central/peripheral/concurrent
  • built-in Wi-Fi/Bluetooth® coexistence
  • host interfaces: UART, SPI, SDIO, USB

Certifications:

  • FCC/ISED/RED
  • Wi-Fi Alliance
  • Bluetooth® SIG

Hardware specifications:

  • LGA 94 pads
  • length x width x height: 14.3 x 13.3 x 2.6 mm (ext. ant.)
  • length x width x height: 18 x 15 x 2.6 mm (int. ant.)
  • temperature range: -40° C to +85° C

Electrical specifications:

  • power supply: 3.3 V

Software features:

  • cloud agent: Amazon AWS IoT, Microsoft Azure
  • security: SecureBoot, WPA3, TrustZone
  • Telit Stile AT commands
  • support for legacy GainSpan AT commands
  • example applications for STM host controllers

Datasheets

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