• Multiple MTC Technologies for Global Connectivity
• 3GPP Rel.14 Cat.M1, Cat.NB1, Cat. NB2
• Global LPWA from a single package
• Breakthrough Things Footprint
• Compact form factor developed for the needs of small, battery-operated devices.
• Large surface pads for improved soldering and reduced SMT warpage
• Easy routing and optimized antenna position
• Ultra Integrated for Lower Total Cost of Ownership
• Ultra integrated module featuring a processor to run your entire application
• Embedded GNSS multi constellation (GPS, Galileo, Glonass, Beidou)
• State of the Art Secure Services
• Pre-provisioned digital identities in the roof of device
• Embedded eSIM option
• Secure key store
• Easy Connectivity and Lifecycle Management
• Secure enrollment into main cloud platforms including AWS IoT Core or Azure IoT Hub
• Remote update and device management

General Features:

• 3GPP Rel.14 Compliant Protocol
• LTE Cat. M1/NB1/NB2
• Power Class 20 dBm (TX62-W) and 23 dBm (TX62-W-B)
• Compatible with Cinterion® Things footprint
• FDD-LTE Bands: 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 27, 28, 66, 71, 85
• Data only
• LTE Cat.M1, DL: max. 300 kbps, UL: max. 1.1 Mbps
• LTE Cat.NB1, DL: max. 27 kbps, UL: max. 63 kbps
• LTE Cat.NB2, DL: max. 124 kbps, UL: max. 158 kbps
• LTE Power Class 5 (20 dBm)
• eDRX (0.8mA 81.92s eDRx and PSM 4.5µA)
• Embedded IPv4 and IPv6 TCP/IP stack access via AT command, provides: TCP/UDP Client, UDP Endpoint, TCP Listener, HTTP client, FTP client, MQTT  client, NTP service, CoAP Client
• Secure Connection with TLS 1.3 / DTLS 1.2
• Secure boot
• Integrated GNSS support (GPS/BeiDou/Galileo/GLONASS)
• 2 high-speed serial interface
• UICC and U/SIM card interface 1.8V (embedded SIM option)
• SPI, I2C, PWM signal line, GPIO´s
• ADC interface