TN23 - efficient MTC Module (LTE Cat.NB2) Global
Our TN23-W NB-IoT module provides highly efficient future 5G connectivity for the IoT with its high power efficiency, advanced security features, and reliability for data-only solutions.
Multiple MTC technologies for global connectivity:
The Cinterion® TN23 IoT Module delivers global LTE NB-IoT (NB1 and NB2) connectivity from a single SKU and it has the revolutionary “Things” footprint. The compact form factor has been engineered to facilitate the design of small, battery-operated LPWA cellular devices such as small payment terminals, connected sensors, track and trace solutions, meterings application, monitoring for smart homes, cities and agriculture.
Key features
The highly efficient Cinterion TN23 delivers global LPWAN LTE connectivity from a single SKU leveraging mature Rel.14 second generation Cat.NB1/NB2. The ultra-integrated IoT module’s unique architecture allows the flexibility to run applications with a host processor or inside the module itself using the integrated processor dedicated to customer application for onboard processing, which optimizes the size and cost of your solution. TN23 supports optimized 3GPP power modes PSM and eDRx revolutionizing design possibilities for battery-operated cellular devices. State of the art security features include trusted identities preintegrated in the root of the module during manufacturing plus secure key storage and certificate handling to protect the device and data and enable trustful enrollment in cloud platforms. An optional integrated eSIM further simplifies manufacturing and logistics while providing flexibility in the field with easy remote provisioning and dynamic subscription updates. What’s more, the TN23 is supported by Cinterion® IoT Suite Services, an optional platform that manages the connectivity, lifecycle and security of IoT solutions ensuring continuity and long life.
Things footprint revolutionizes small, battery-operated industrial IoT
The tiny 15 x 15 mm Things footprint is revolutionizing possibilities for exceptionally small, battery-operated cellular IoT devices. The footprint design features an optimized, pad position and pitch to prevents PCB warpage while taking full advantage of affordable PCB technology. In addition, the position of antennas and ground maximizes RF performance.
Embedded Processing lowers TCO
The Cinterion TN23 device features an integrated processor with Real-Time Operating System (RTOS), enabling hostless architecture offered with SDK to build and run your entire application on the small featurepacked module.
Optional eSIM simplifies and secures IoT connectivity
A embedded SIM strengthens security, authenticates devices, encrypts data and supports secure remote cellular connectivity provisioning. It works seamlessly with subscription management solution to manage connectivity for the lifecycle of devices. All this simplifies integration, manufacturing and logistics and lowers TCO.
Connectivity Solutions
NExT™ powered by Telit Cinterion is a cloud native core network. Telit Cinterion is a full tier 1 MVNO, enabling new and enhanced turnkey connectivity solutions and device management services. With this IoT network, you can deploy powerful, intelligent Global roaming with multi -IMSI and localization capabilities (eUICC) on more than 600 mobile carriers in 200+ countries in 2G/3G/4G/CAT-M/NB-IoT & 5G. The NExTPro management tool provides full visibility, monitoring & analytics. In addition, Telit Cinterion offers Connectivity Activation, a remote SIM provisioning service that leverages latest eSIM technology to simplify and optimize connectivity provisioning and M(V)NO selection. Connectivity Activation digitalizes SIM provisioning and makes the IoT journey seamless and efficient for your devices, from the factory to the last day of operation.
Product Features
