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THGBMJG7C1LBAIL
Manufacturer's P/N: THGBMJG7C1LBAIL
Manufacturer: Brak producenta

EMMC 16GB eMMC 5.1 2D 15nm -25°C to 8°5C
Memory typeeMMC
Memory size16GB
Communication interfacesSLC
ChassisFBGA-153
Standard packaging:
1 pcs.

Minimum order:
1 pcs.

Minimum batch:
1 pcs.

In stock:
Available

Specification:

  • process: FG NAND
  • density: 16GB
  • operating temperature: -25~+85°C
  • ver: 5.1
  • VCC: 3.3V
  • VCCQ: 1.8V/3.3V

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