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WiFi, Bluetooth, Combo ICs/modules

ATWINC1500-MR210PA>
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Manufacturer's P/N: ATWINC1500-MR210PA
Manufacturer: Microchip

SmartConnect ATWINC1500-MR210PA MODULE
Integrated circuit/modulemodule
TechnologyWiFi
Communication interfacesSPI
Frequency2.4 GHz
Standard packaging:
50 pcs.

Minimum order:
1 pcs.

Minimum batch:
50 pcs.

In stock:
Available

The ATWINC15x0-MR210xB is a low power consumption 802.11 b/g/n IoT (Internet of Things) module,specifically optimized for low power IoT applications. The module integrates Power Amplifier (PA), Low-Noise Amplifier (LNA), Switch, Power Management, and a printed antenna or a micro co-ax (u.FL) connector for an external antenna resulting in a small form factor (21.7 x 14.7 x 2.1 mm) design. It is interoperable with various vendors’ 802.11 b/g/n access points. This module provides SPI ports to interface with a host controller.

Features:

  •  IEEE® 802.11 b/g/n 20 MHz (1x1) solution
  • Single spatial stream in 2.4 GHz ISM band
  • Integrated Transmit/Receive switch
  • Integrated PCB antenna or u.FL micro co-ax connector for external antenna
  • Superior sensitivity and range via advanced PHY signal processing
  • Advanced equalization and channel estimation
  • Advanced carrier and timing synchronization
  • Wi-Fi® Direct (supported till firmware release 19.5.2)
  • Soft-AP support
  • Supports IEEE 802.11 WEP, WPA, WPA2 security
  • Support Enterprise security with WPA/WPA2 (802.1X)(1)
    • EAP-TLS
    • EAP-PEAPv0/1 with TLS
    • EAP-TTLSv0 with MSCHAPv2
    • EAP-PEAPv0/1 with MSCHAPv2
  • Superior MAC throughput via hardware accelerated two-level A-MSDU/A-MPDU frame aggregation and block acknowledgment
  • On-chip memory management engine to reduce host load
  • SPI host interface
  • Operating temperature range from -40°C to +85°C. RF performance at room temperature of 25oC with a 2-3 db change at boundary conditions
  • I/O operating voltage of 2.7V to 3.6V
  • Built-in 26 MHz crystal
  • Integrated Flash memory for system software
  • Power Save modes
    • 4 µA Power-Down mode typical at 3.3V I/O
    • 380 µA Doze mode with chip settings preserved (used for beacon monitoring)(2)
    • On-chip low power sleep oscillator
    • Fast host wake-up from Doze mode by a pin or SPI transaction
  • Fast Boot options
    • On-chip boot ROM (Firmware instant boot)
    • SPI flash boot
    • Low-leakage on-chip memory for state variables
    • Fast AP re-association (150 ms)
  • On-chip Network stack to offload MCU
    • Integrated Network IP stack to minimize host CPU requirements
    • Network features TCP, UDP, DHCP, ARP, HTTP, TLS, and DNS
    • Hardware accelerators for Wi-Fi and TLS security to improve connection time
  • Hardware accelerator for IP checksum
  • Hardware accelerators for OTA security
  • Small footprint host driver
  • Wi-Fi Alliance® certifications for Connectivity and Optimizations

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